[Asis-l] Proceedings of the IEEE tackles Flexible Electronics

[j.platt at ieee.org]

(Cross-posted. Please excuse any duplication.)


IEEE has released a two-part analysis on flexible electronics technology in
the July and August 2005 special issues of Proceedings of the IEEE, the
flagship journal of IEEE. The issues examine flexible electronics, a term
that represents a range of device and materials technologies built on
flexible and conformal substrates such as thin plastic or metal foils.

The July issue (v. 93, no. 7) focuses on topics that surround the systems
and applications aspects of flexible electronics, such as identifying
unique applications, as well as the dilemma that mechanical stress induced
performance degradation poses on transistors and flexible substrates.

The August issue (v. 93 no. 8) explores topics concerning the materials and
devices aspects of the technology, including how to develop adequate energy
storage and portable power sources for its employment.

Papers in these issues place a special emphasis on ideas and concepts that
could enable future commercial applications of flexible and large area
electronics, such as printed transistors, embedded power sources,
integrated sensing devices, and other influential technologies.


To preview these issues, visit:
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=5



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John R. Platt
IEEE Business Communications Manager
445 Hoes Lane, Piscataway, NJ 08854, USA
Phone: +1 732 981 3449     Email: j.platt at ieee.org
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